S3T1 10:00-10:30 Ira Blevis, Principal Engineer, GE healthcare, molecular
imaging, GE (invited)
Recent advances in semiconductor radiation detectors for medical imaging
S3T2 10:30-11:00 Alon Litman, Applied Materials Israel (invited)
Fast e-beam microscopy for high volume IC inspection
S3T3 11:00-11:30 Noam Sapiens, Advance development scientist, KLA-Tencor
(invited)
Challenges in overlay metrology
S3T4 12:00-12:15 Ram Oron, Orbotech
Multi-modal PCB inspection
S3T5 12:15-12:30 Haim Feldman, Applied Materials Israel
Aerial Scanning-Spot imaging Equivalence
S3T6 12:30-12:45 Angela Duparré, Fraunhofer Institute for Applied Optics and
Precision Engineering (IOF)
Laser based light scattering techniques for efficient optical quality control
S3T7 12:45-13:00 Avner Safrani, Department of Electro optic Engineering and the
Ilse Katz Institute for Nanoscale Science and Technology, Ben Gurion University
Depth limitation due to temporal and spatial coherence competence in full field
interference microscopy and optical coherence tomography
S3T8 13:00-13:15 Gadi Peleg, Aplied Physics Branch, Soreq NRC
New developments in terahertz imaging and tomography with applications in
sensing and inspection
S3T9 13:15-13:30 Yair Rivenson, Department of Electrical and Computer
Engineering, Ben-Gurion University
Single shot super resolution by combining double random phase encoding and
compressive sensing